Point72 Asset Management, L.P. Reduces $6M in Amkor Technology, Inc. ($AMKR)

Key Points

  • Point72 Asset Management, L.P. changed its Amkor Technology, Inc. ($AMKR) stake by 2.3% last quarter, cutting to 2,993,434 shares worth $235.91 million.
  • $AMKR last traded around $78.81.

Point72 Asset Management, L.P. trimmed its position in Amkor Technology, Inc. ($AMKR) by 2.3% during the most recent quarter, according to its most recent Form 13F filing with the Securities and Exchange Commission. The fund owned 2,993,434 shares of Amkor Technology, Inc. after selling 70,667 shares during the quarter. Point72 Asset Management, L.P.'s holdings in Amkor Technology, Inc. were worth $235.91 million as of its most recent filing.

Amkor Technology, Inc. ($AMKR) Stock

Last price$78.81
Market cap$20.52B
P/E ratio47.57
Forward P/E33.76
PEG ratio0.76
Beta2.26
52-week low$19.79
52-week high$83.30
50-day MA$68.55
200-day MA$46.55
Current ratio2.01
Quick ratio1.70
Debt-to-equity0.35

Amkor Technology, Inc. Earnings

EPS (ttm)$1.74
Revenue (ttm)$7.07B
Revenue growth27.5%
Net margin6.2%
Return on equity10.0%
Next earningsApr 27, 2026

Amkor Technology, Inc. Dividend

Annual dividend$0.33
Dividend yield40.00%
Payout ratio19.1%
Ex-dividend dateJun 3, 2026

Analysts Set New Price Targets

Average target$75.50
High target$90.00
Low target$60.00
Analysts covering8

About Amkor Technology, Inc.

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

ExchangeNasdaqGS
SectorTechnology
IndustrySemiconductor Equipment & Materials
HeadquartersTempe, AZ
CEOMr. Kevin K. Engel
Employees30,800

See Also

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